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Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist and spin coatable hard mask materials to transfer the resist patterns. Spin coatable
Exclusive summit will engage key stakeholders across the ocean shipping community in interactive dialogue on how to leverage next-gen automation to rise to industry challenges and drive productivity
Russ Cruse, Southwest Regional Manager with H nel Storage Systems, is scheduled to present on the benefits of Vertical Lift Modules (VLMs) at MODEX 2018 in Atlanta.